 适用于:酸性电镀铜、线路板、电铸模、制版电镀等。Apply to:apply to: Acid electroplated copper, electric circuit board, electroforming mould and electroplating for printing plate making etc..
| 性能描述 |
主元素Major element 杂质元素含量（%）Impurity element content
元素Element Cu P Pb Zn Ni Mn Fe AI Si Sb Sn As Cd Ag
含量Content ≥99.92 ≥0.040≤0.065 ≤0.003 ≤0.003 ≤0.002 ≤0.001 ≤0.003 ≤0.001 ≤0.001 ≤0.001 ≤0.003 ≤0.002 ≤0.0001 ≤0.002 | , |
